POLISHING DEVICE AND METHOD OF POLISHING SEMICONDUCTOR WAFER

摘要

According to an embodiment, a polishing device includes a stage, a polishing unit, and a strain measuring unit. The stage is rotatable together with a semiconductor wafer. The polishing unit polishes the rear surface of the semiconductor wafer mounted on the stage beside the stage. The strain measuring unit measures a first strain that is a radial-direction strain of the semiconductor wafer and a second strain that is a circumferential-direction strain of the semiconductor wafer during the polishing.

主权项

1. A polishing device comprising:
a stage on which a semiconductor wafer is mounted, the stage sucking a center side of a rear surface of the semiconductor wafer and being rotatable together with the semiconductor wafer; a polishing unit that applies a force to and polishes the rear surface of the semiconductor wafer mounted on the stage, the polishing unit polishing the rear surface of the semiconductor wafer beside the stage sucking the center side of the rear surface of the semiconductor wafer; and a strain measuring unit that measures a first strain and a second strain during the polishing, the first strain being a radial-direction strain of the semiconductor wafer, the second strain being a circumferential-direction strain of the semiconductor wafer, the strain measuring unit being disposed on the stage.