发明名称 EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, RESIN COMPOSITION VARNISH, PREPREG, METAL CLAD LAMINATE, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD
摘要 <p>An epoxy resin composition for printed wiring board characterized by containing (A) epoxy resin component containing epoxy resin (A-1) having a nitrogen atom and a bromine atom in each single molecule, (B) phenolic hardener component containing phenolic resin (B-1) and (C) hardening accelerator component containing imidazolesilane compound (C-1).</p>
申请公布号 WO2008032383(A1) 申请公布日期 2008.03.20
申请号 WO2006JP318265 申请日期 2006.09.14
申请人 MATSUSHITA ELECTRIC WORKS, LTD.;TAMIYA, HIROKI;NAKAMURA, YOSHIHIKO;ARAKI, SHUNJI;IMAIZUMI, EIJI;FUJINO, KENTAROU;SAWADA, TOMOAKI;SHINPO, TAKASHI 发明人 TAMIYA, HIROKI;NAKAMURA, YOSHIHIKO;ARAKI, SHUNJI;IMAIZUMI, EIJI;FUJINO, KENTAROU;SAWADA, TOMOAKI;SHINPO, TAKASHI
分类号 C08G59/20;B32B15/08;C08J5/24;H05K1/03;H05K3/46 主分类号 C08G59/20
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