发明名称 Verfahren zur Verbindung von Metallen mit halbleitenden metallischen oder nichtmetallischen Oberflaechen
摘要 <p>In a method of effecting a thermo-compression bond between a metal 7 and a glass or ceramic surface 8 the parts are brought to at least 100 DEG C. but less than the lowest eutectic temperature of the materials to be bonded, and are then forced together by a tool having a protuberance, to produce, under said protuberance, a deformation in the metal 7 of between 20% and 80% while a shoulder on the tool with a face 2 <PICT:1106163/C1/1> constrains the plastic flow of the metal and permits the formation of an edging around the area of the bond. The metal may be in the form of tape, wire or strip and made of aluminium, aluminium alloy, gold, gold alloy, copper, platinum or silver and the bonding operation may be carried out in a protective atmosphere e.g. nitrogen. The protuberance 3 may have parallel or conical sides and the face 2 may be either flat, convex conical or concave conical. The cross-section of the protuberance and shoulder may be round, square or elliptical and the end face of the protuberance 3 may be flat convex or concave, spherical or conical.</p>
申请公布号 DE1540268(A1) 申请公布日期 1970.07.16
申请号 DE1965P036180 申请日期 1965.03.01
申请人 POSTAL ADMINISTRATION OF THE UNITED KINGDOM OF GREAT BRITAIN AND NORTHERN IRELAND 发明人 BAKER,DENNIS;EWART BRYAN,IAN
分类号 B23K20/00;B23K20/02;B32B15/08;C03C27/02;C04B37/02;H01L21/00 主分类号 B23K20/00
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