| 摘要 |
PURPOSE: To provide a wafer ring supplying and returning device, which can contract the wafer sheet of a used wafer ring during the bonding operation of a die bonder and, in addition, can be reduced in cost and size by simplifying the device and its control system. CONSTITUTION: This wafer ring supplying and returning device has a magazine 10 for housing wafer rings 3, a jig holder 5 which holds the wafer rings 3, and a drier 30 which contracts the wafer sheets of used wafer rings 3. The device also has a chuck section 15, which transfers the wafer rings 3 by chucking the rings 3, buffer sections 21 each of which has two support grooves on its top and bottom sides, and a wafer-pushing member 31 which is provided above or below the chuck section 15 to push the wafer rings 3. The chuck section 15 is provided corresponding to one sides of the wafer support grooves of the buffer sections 21. the wafer-pushing member 31 is provided, corresponding to the other wafer supporting grooves of the buffer sections 21.
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