| 摘要 |
The burn-in socket includes a seat made from an anisotropy conductive material to electrically conduct only in a vertical direction, and a bump of the semiconductor chip for performing a burn-in test on its surface; a supporting part fixed to the seat by a fixing means to support and arrange the semiconductor chip; a board having the seat on the upper part, an internal pad electrically connected with the semiconductor chip through the seat, and a contact pad to connect the internal pad to an input/output terminal; a lower socket having the seat, board and input/output terminal for connecting to the outside; and an upper socket mounted on the lower socket and having a pressing means on the lower surface to cut the semiconductor chip from outside.
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