| 摘要 |
PURPOSE:To prevent flow of bonding wire by a resin by molding a resin sealing package with a pressure molding method and locating the gate toward the center of radial wires. CONSTITUTION:A heated and molten resin 45 is supplied with pressure to each cavity 40 from a pot 34 by a plunger 35 through a runner 37 and a gate 38. Thereby, a resin sealed package is formed. In this case, since the gate 38 is provided at the center of cavity 40, the resin 45 pressurized to the cavity 40 from the gate is radially diffused along each wire 26 from the center of cavity 40 to fill it. Therefore, flow of wire 26 by the resin 45 is prevented. |
