PASSIVATED AND ENCAPSULATED SEMICONDUCTORS AND METHOD OF MAKING SAME

摘要

A semiconductor assembly having a semiconductor and conductive lead members secured thereto by conductive metal contact members is passivated by a layer of fused particles of non-conductive glass and encapsulated in a layer of non-conductive plastic. The product combines the best characteristics of a glass passivated semiconductor and a plastic encapsulated semiconductor while avoiding the disadvantages of both.