| 摘要 |
PURPOSE:To lessen the falling troubles of lead terminals in the mounting process by a method wherein the buffer means having specific spring elasticity are provided between welding parts to an electrode surface of lead terminals and fixing legs of a circuit substrate. CONSTITUTION:Respective lead terminals 11, 12 are provided with welding parts 11a, 12a to be welded an electrode surface 2b as well as fixing legs 11b, 12b to be inserted in mounting process into fixing holes perforated in an circuit substrate (not shown) while buffer means 13 having specific spring elasticity are formed between the welding parts and the fixing legs. The buffer means 13 are composed of bent parts 11c, 12c formed in almost U-shape by bending the specific part of the fixing legs 11b, 12b almost right angle while the welding parts 11a, 12a sides are turned up at almost 180 deg.. Through these procedures, the mechanical stress imposed in the substrate mounting process can be relieved by the bent parts 11c, 12c thereby enabling the falling troubles of the lead terminals 11, 12 to be lessened notably. |
