| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for semiconductor device which allows for further compaction of a semiconductor device, while increasing the formation density of the semiconductor devices.SOLUTION: A metal part 11 becoming a semiconductor element mounting part 11a and/or an electrode part 11b is provided on a matrix substrate 10, and an overhanging portion 11c is formed in the metal part 11. The overhanging portion 11c has a lower surface parallel with a direction perpendicular to the axial direction of the metal part 11, an upper surface formed continuously to the upper surface of the metal part 11, and a side face formed between the lower surface and upper surface. Consequently, the arrangement interval of the metal parts 11 can be reduced, while ensuring a minimum necessary overhanging amount for obtaining sufficient strength against missing, as the overhanging portion 11c provided in the metal part 11.SELECTED DRAWING: Figure 2 |
