| 摘要 |
PROBLEM TO BE SOLVED: To avoid the occurrence of thin flashes in a mount bed part. SOLUTION: In a mold for resin-sealed semiconductor element for use in molding of a resin-sealed semiconductor element having a first lead part and a second lead part, which is larger in a width dimension than the first lead part, the width dimension of a groove 13 part of a mold, corresponding to the first lead part and a width dimension of a groove 14 part of the mold, corresponding to the second lead part have the same cross-sectional shape.
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