| 摘要 |
In a plasma treating apparatus for carrying out a plasma treatment by setting a plate-shaped work to be an object, an electrode member 46 to abut on a lower surface of the work is constituted by soldering a plate-shaped suction member 45 having a plurality of through holes 45a formed thereon and a cooling plate 44, and a sprayed film 65 obtained by spraying alumina is formed on an upper surface of the suction member 45, and furthermore, an edge of a hole portion 45d in which the through holes 45a are formed is covered with the sprayed film 65. Consequently, it is possible to reduce a consumption of the electrode member due to sputtering to prolong a lifetime, thereby decreasing a component consuming cost and preventing an inner part of the apparatus from being contaminated by a scattered substance.
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