| 摘要 |
<p>An apparatus and a method for forming a metal thin layer by using laser are provided to process the formation of a laser beam according to the shape and size of a working object and to form a metal thin layer as a desired path. Two contact holes are formed on the cut metal pattern in order to form a thin film(S40). A metal gas is injected into the contact hole so that the contact hole is completely filled(S41). A metal thin film is formed between the two contact holes so that the contact holes are connected(S42). By these processes, the metal thin film is formed and the cut portion is connected. After forming the thin film, when there is a layer made of conductive materials, the laser is irradiated so that the thin film and the conductive materials at the circumference are separated. By controlling the output of the laser, when forming a hole, the meta pattern is melted and contacted with the wall of the hole. When forming the hole, the insulating layer is removed and the hole is also formed at the metal pattern simultaneously.</p> |
