发明名称 |
Flexible stack packages having wing portions |
摘要 |
A flexible stack package includes a first package and a second package. Each of the first and second packages includes a flexible layer, a chip embedded in the flexible layer, and a contact portion disposed on the chip to penetrate the flexible layer and exposed at a surface of the flexible layer. Each of the first and second packages includes a fixing portion and a wing portion. A first adhesion part is disposed between the fixing portion of the first package and the fixing portion of the second package to combine the first package with the second package. A first stretchable interconnector electrically connects or couples the contact portion of the first package to the contact portion of the second package. |
申请公布号 |
US9425169(B2) |
申请公布日期 |
2016.08.23 |
申请号 |
US201414495686 |
申请日期 |
2014.09.24 |
申请人 |
SK HYNIX INC. |
发明人 |
Kim Jong Hoon |
分类号 |
H01L23/48;H01L25/065 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
1. A flexible stack package comprising:
a first package and a second package, each of the packages including:
a fixing portion;a wing portion; anda chip embedded in a flexible layer, the flexible layer exposing a contact portion disposed on the chip; a first adhesion part binding the fixing portion of the first package to the fixing portion of the second package without protruding into a first surface of the first package and a second surface of the second package, the first surface and the second surface facing each other; and a first stretchable interconnector electrically coupling the contact portion of the first package to the contact portion of the second package. |
地址 |
Icheon KR |