发明名称 Flexible stack packages having wing portions
摘要 A flexible stack package includes a first package and a second package. Each of the first and second packages includes a flexible layer, a chip embedded in the flexible layer, and a contact portion disposed on the chip to penetrate the flexible layer and exposed at a surface of the flexible layer. Each of the first and second packages includes a fixing portion and a wing portion. A first adhesion part is disposed between the fixing portion of the first package and the fixing portion of the second package to combine the first package with the second package. A first stretchable interconnector electrically connects or couples the contact portion of the first package to the contact portion of the second package.
申请公布号 US9425169(B2) 申请公布日期 2016.08.23
申请号 US201414495686 申请日期 2014.09.24
申请人 SK HYNIX INC. 发明人 Kim Jong Hoon
分类号 H01L23/48;H01L25/065 主分类号 H01L23/48
代理机构 代理人
主权项 1. A flexible stack package comprising: a first package and a second package, each of the packages including: a fixing portion;a wing portion; anda chip embedded in a flexible layer, the flexible layer exposing a contact portion disposed on the chip; a first adhesion part binding the fixing portion of the first package to the fixing portion of the second package without protruding into a first surface of the first package and a second surface of the second package, the first surface and the second surface facing each other; and a first stretchable interconnector electrically coupling the contact portion of the first package to the contact portion of the second package.
地址 Icheon KR