| 摘要 |
PURPOSE:To enable to perform an automatic bonding even when the position of a pellet is deviated slightly from the reference position by a method wherein the amount of positional deviation of the pellet is electrically detected and correction is made for the reference vector which was programmed in advance. CONSTITUTION:The amount of microscopic movements of the first table 3, which is slidable in XY direction on the device body 1 whereon the semiconductor pellet is placed by means of a chessman 2, is detected by electric micrometers 7, an analogue signal is converted into a digital signal by an AD circuit 9 through the intermediary of a detection timing circuit 8 and the digital signal is sent to a computer 10 having an XY moving program with which a capillary 5 will be moved in the XY direction established in advance. Then, the signal of said micrometers 7 is compared with the XY direction moving program signal which was established in advance, calculated into a correction signal and the capillary 5 is moved in the XY direction by pulse motors 4. |
