METHOD OF REPAIRING A CONDUCTIVE LINE OF A THIN FILM IMAGER OR DISPLAY DEVICE AND STRUCTURE PRODUCED THEREBY

摘要

A method for repairing address lines in a thin film imager device includes the steps of removing non-conductive material from a selected repair area so as to expose an open circuit defect in a first conductive component and portions of the first conductive component adjoining the defect, and then depositing conductive material to form a second conductive component and to coincidentally form a repair shunt in the selected repair area that is disposed in electrical contact with the adjoining exposed portions of the first conductive component so as to electrically bridge the open circuit defect. Removal of the non-conductive material to form the selected repair area is accomplished with an excimer laser, allowing the formation of a selected repair area having desired dimensions and substantially planar surfaces. Following formation of the repair shunt, any conductive material disposed between the repair shunt and the second conductive component is removed to electrically isolate the repair shunt from the second electrically conductive component.