发明名称 Vorrichtung zur Abblendung von Galvanisiergut in Durchlaufanlagen
摘要 The inventive device is used for electrolytic treatment of plate-shaped articles, preferably printed circuit boards, in a continuous production process, whereby the articles are conveyed on a plane in a substantially horizontal direction. The device on the conveyor plane has substantially parallel opposite-lying electrodes (2) and hoods (11) arranged between the conveyor plane and the counter-electrodes to shield high-density power fields on the edge areas of the articles (1), wherein the hoods are configured as at least two substantially parallel mounted flat sections (12, 13). At least one hood section (13) is arranged opposite to the conveyor plane and the other section (12) is arranged opposite to the counter-electrodes. The hoods can be movably arranged in a direction (20) running substantially parallel to the conveyor plane and substantially perpendicular to the direction of conveyance (23). The inventive device enables the useful area of the printed circuit boards to be extended by approximately 12 mm to an edge wherein the required thickness tolerance of the deposited metal layer can no longer be maintained.
申请公布号 DE19717510(C1) 申请公布日期 1998.10.01
申请号 DE1997117510 申请日期 1997.04.25
申请人 ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE 发明人 PLOESE, WOLFGANG, 16816 NEURUPPIN, DE;KOPP, LORENZ, 90518 ALTDORF, DE;WAECHTER, RALF-PETER, 90518 ALTDORF, DE
分类号 C25D5/00;C25D17/00;H05K3/24;(IPC1-7):C25D17/00;C23F1/08;H05K3/00;C25D7/00 主分类号 C25D5/00
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