| 摘要 |
Fabricating ( 100, 1300 ) a printed circuit board includes fabricating patterned conductive traces ( 305, 310, 1410, 1415 ) onto a foil, laminating the patterned conductive traces to a printed circuit board substrate ( 405, 1505 ) by pressing on the foil, such that the conductive traces are pressed into a dielectric layer of the printed circuit board, and removing the foil to expose a co-planar surface of conductive trace surfaces and dielectric surfaces. Removal may be done by peeling ( 125 ) and/or etching ( 130, 1315 ).
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