| 摘要 |
<p>PURPOSE: To prevent packaging failure due to the bent leads of a semiconductor device by forming an outer lead with a shape memory alloy, sealing it, and then forming it into a specific shape and performing shape memory treatment. CONSTITUTION: A semiconductor chip 5 is subjected to dicing to a tab 3b of a lead frame 3 formed out of a shape memory alloy, the semiconductor chip 5 and a lead 3a are electrically connected by a bonding wire 6, and the semiconductor chip 5 and the bonding wire 6 are sealed with mold resin 4. Then, the frame body of the lead frame 3 is separated and an outer lead 3a1 is formed in to a gull-wing shape and the outer lead 3a1 in gull wing shape is subjected to shape memory treatment. Therefore, even if the lead is bent, it automatically restores its original shape by the heat of soldering on packaging, thus preventing such packaging failure as contact failure in advance.</p> |
