A BALL GRID ARRAY STRUCTURE AND METHOD FOR PACKAGING AN INTEGRATED CIRCUIT CHIP

摘要

An integrated circuit package (210) comprising a substrate that has a dielectric layer and a micro-filled via formed substantially in the center of a hole in the dielectric layer is disclosed. The IC package substrate has at least one chip bonding pad and one ball attach pad (201) that are electrically coupled to each other by the micro-filled via. The micro-filled via is formed of a material called a "micro-filled via material" that includes a binding material and optionally includes a number of particles dispersed in the binding material. The binding material can be any material, such as a polymer that is either conductive or nonconductive. The particles can be formed of any conductive material, such as a conductive polymer or a conductive metal.