| 摘要 |
<p>PURPOSE:To perform needle contacting inspection effectively, by forming a dedicated inspecting electrode, exposing and setting a part of said electrode corresponding to, e.g., a scribing line part, and forming a needle contacting inspection part by the exposed part. CONSTITUTION:On the surface of a field insulating film 12, a dedicated inspection electrode layer 15 comprising polysilicon is formed along a part from a chip area (a) to a scribing line (b). On the surface of a semiconductor chip, a surface protecting film 16 comprising an insulator is formed. A connecting pad region 17 for wire bonding, in which a wiring metal layer 14 is exposed, is opened in the protecting layer 16. The inspecting electrode layer 15 is exposed, and a dedicated pad region 18 is formed. Namely, the pad region 17, which is formed in the lead-out electrode 14 for the wire bonding, is not required for needle contacting inspection. Thus the bonding wire is coupled in the pad region 17 at sufficient strength. Not only the electrode layer 14 but also a substrate insulating layer 13 are not damaged and the reliability is sufficiently secured.</p> |
