| 发明名称 |
PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS WITH PLATED RESISTORS |
| 摘要 |
<p>A process and product manufactured by the process is revealed whereby resistors (16) can be manufactured integral a printed circuit board (10, 13) by plating the resistors onto an insulative substrate (10). Uniformization of the insulative substrate by etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.</p> |
| 申请公布号 |
WO0201636(A1) |
申请公布日期 |
2002.01.03 |
| 申请号 |
WO2001US07279 |
申请日期 |
2001.03.07 |
| 申请人 |
MACDERMID, INCORPORATED |
发明人 |
KUKANSKIS, PETER;LARSON, GARY, B.;BENGSTON, JON;SCHWEIKHER, WILLIAM |
| 分类号 |
C23C18/18;H01C17/065;H01C17/18;H01L23/12;H05K1/16;H05K3/06;H05K3/18;H05K3/24;H05K3/26;H05K3/38;(IPC1-7):H01L23/48;H01L21/31;H01L21/461;H01L21/302;H01L21/44;H01L23/52;H01L29/40;H01L21/20;H01L21/469 |
主分类号 |
C23C18/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
