发明名称 |
Method of making conductor contacts having enhanced reliability |
摘要 |
Methods for forming conductor contacts provide for etching through a capping layer located upon a conductor contact region within a substrate. A first pair of methods provide for etching through at least a lower thickness of the capping layer with other than a reactive ion etch to provide an exposed conductor contact region. A partially overlapping second pair of methods provides for converting at least an upper thickness of the capping layer to a converted material layer that is removed incident to providing an exposed conductor contact region. As adjunct to any of the methods, a liner layer is formed and located upon the exposed conductor contact region in absence of an undesirable reactive environment.
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申请公布号 |
US7480990(B2) |
申请公布日期 |
2009.01.27 |
申请号 |
US20060306668 |
申请日期 |
2006.01.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FITZSIMMONS JOHN A.;COTE WILLIAM J.;GRECO NANCY A.;IVERS THOMAS H.;MOSKOWITZ STEVEN |
分类号 |
H05K3/02;H01L21/302 |
主分类号 |
H05K3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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