摘要 |
A thermocompression, tailless wire bonder which permits the bonding operation to take place at any location along the path of the bonding tool without affecting the length of wire protruding below the bonding tool or the location of the end of the wire relative to the torch. A non-frictional wire tensioning device is employed to produce a constant and adjustable tension on the bonding wire. A virtual image, parallax free, optical positioning system is utilized to position the bonding tool.
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