发明名称
摘要 <p>A circuit assembly (10) (e.g., printed circuit board) including an insulative substrate (13) having opposed surfaces (15, 17) each defining a walled opening (25) therein. Each walled opening includes a layer (31) of conductive material (e.g., copper) plated thereon, these openings being electrically connected through a common channel (35) or the like, which channel in turn has been plated to include copper material therein. Located within each opening is a compliant contact pin (41, 43) including a compliant end portion (45) designed to provide an interference fit within one of the respective openings and an extending portion (61) designed for extending from the board's outer surfaces to be electrically connected to a designated external component (e.g., printed circuit board, wiring, conductive socket). Utilization of opposed pins, walled openings, and a narrow channel as defined herein allows the greater utilization of board internal volume to thus accommodate higher circuit densities particularly in the areas of the insulative board between the spaced apart, plated openings.</p>
申请公布号 JPH0610997(B2) 申请公布日期 1994.02.09
申请号 JP19890320696 申请日期 1989.12.12
申请人 INTAANASHONARU BIJINESU MASHIINZU CORP 发明人 REIMONDO JOSEFU KOSHIMANO;REINHOORUDO AANESUTO TOMEKU
分类号 H01R12/52;H01R12/58;H05K1/11;H05K3/42;(IPC1-7):H01R9/09 主分类号 H01R12/52
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