SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

On a main plane of a wafer (1), a plurality of chip areas (1A') separated from each other by scribe areas (SA) having a width of several µm are formed. A planar shape of the chip area (1A') is rectangular with chamfered corner sections. The scribe area (SA) in an area in contact with the corner section has a wider width compared with widths of other areas, and has a TEG (2) arranged thereon. To divide the wafer (1) into chips, a laser dicing method is employed for irradiating the scribe area (SA) with a laser beam and forming a breaking layer inside the wafer (1) along the scribe line (SA).