| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip set cooling structure for an electronic equipment, wherein a chip set is efficiently cooled even when a CPU where a heat- accumulated chip set is coupled is mounted on a substrate along its surface direction. SOLUTION: A first heat radiating plate 3 is attached on the surface of a chip set 2, a heat sink 6 is attached to the upper part of a CPU 5, and a second heat radiating plate 7 connected to the heat sink is attached to the lower part of the CPU, so that the first and second heat radiation plates 3 and 7 are made to contact together when the CPU is connected to a connector 9.
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