| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the escape of flux when a solder ball is soldered and to prevent defective connections of solder bumps in a BGA semiconductor device. SOLUTION: This semiconductor device is provided with a hole 10 formed at the specified position of an insulating resin film 9. In a wiring film, a wiring 11 such as a via land 11b is formed on one main surface, and a semiconductor element is deposited and mounted on a wiring film. A resin sealing layer 14 seals the mounting part of the semiconductor element, and a solder bump 15 is buried in the hole 10 and connected to the via land 11b. Furthermore, since the hole 10 is of square cross-sectional shape and the gap is present between the inner wall surface of the hole and the inserted solder ball at the time of solder reflow, the flux for soldering readily escapes through the gap to the outside, and the filling of the solder in the hole is performed satisfactorily. |
