| 摘要 |
PURPOSE:To provide high density mounting by forming an insulative resin part, which is to form consolidated molding with a conductor wire, in a shape capable of being fixed to an electronic circuit base board. CONSTITUTION:An insulative resin part 3 is made in a shape capable of being fixed to an electronic circuit board 6. Accordingly the module terminal thereof is fixed to the circuit board 6 by this insulative resin part 3, and it eliminates otherwise required process to perform fixation to the circuit board 6 by clinching the end of a conductor wire protruding at the rear side of the circuit board 6, which enables mounting of the module terminal without providing any dead space for a clinch unit. Accordingly no connection of conductor wire is made on the rear side of the circuit board 6, which permits mounting of electronic parts on both sides of the circuit board 6 to accomplish high density mounting. |
