| 摘要 |
PURPOSE:To contrive a reduction in a heat resistance ranging from a semiconductor element to a heat sink by a method wherein a substrate for semiconductor element mounting use is made using a material of a heat conductivity higher than that of an insulating substrate provided with a wiring pattern. CONSTITUTION:Alumina ceramic is used as the material for an insulating substrate 2 having a wiring pattern and external terminals 5, a seal ring 10 and a substrate 3 for semiconductor element mounting use are soldered to the substrate 2 with a brazing metal 4. Alumina nitride ceramic is used as the material for the substrate 3, a semiconductor element 7 is fixed on the substrate 3 using the brazing metal 4 and after the element 7 is electrically connected with the wiring pattern on the electrical insulating substrate 2 having the wiring pattern by a wire 8, a cap 9 is welded on the ring 10 and the element 7 is harmetically sealed. Lastly, a heat sink 1 is bonded on the periphery of the cap 9 over the substrate 2 with a bonding agent 6. In such a way, a material of a heat conductivity higher than that of the substrate 2 is used for the substrate 3. Thereby, a reduction in a heat resistance ranging from the element 7 to the sink 1 is contrived. |
