| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical integrated module where a ball bump is easily arranged and moreover a positional adjustment in the orthogonal direction between optical devices using the ball bump as an interposing member is precisely performed. SOLUTION: In a composition wherein the lower surface 32a of a pad 32 which is formed on the lower surface 30a of an LD 30 is abutted on the upper part of the ball bump 13 which is interposed between a substrate 10 and the LD 30, the LD 30 is relatively moved by a prescribed quantity from the abutting position relatively to the substrate 10, and the LD 30 is fixed onto the substrate 10 at a position after moving, a solder arranging hole 5 for placing the ball bump 13 is provided on the substrate 10. |
