| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device superior in mounting reliability and productivity. SOLUTION: In order to relieve the thermal strain an a semiconductor device and a mounting substrate, a strain-relief layer is arranged between a semiconductor chip 5 and a wiring layer in which wiring 4 is formed. As the strain-relief layer, an adhesive sheet is used which consists of a three-layer structure of a core layer 1 having a three-dimensional mesh structure and adhesive layers 2. the thickness ratio of the core layer 1 is at least 0.2 of the total strain-relief layer. By using the adhesive sheet, the manufacturing process can be simplified, so that productivity is improved. Since thermosetting silicone material is not used, the semiconductor chip is not contaminated at the time of setting by heating. Furthermore, from the effect of the core layer having the three- dimensional mesh structure, vapor at the time of mounting reflow is released, and swelling and exfoliation of the wiring layer are not generated, so that mounting reliability is improved.</p> |
