发明名称 |
Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides |
摘要 |
A polymide comprises structural units represented by the following formula: <IMAGE> wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process for the production of the polyimide and a thermosetting resin composition comprising the polyimide and a particular polymaleimide are also disclosed.
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申请公布号 |
US5510425(A) |
申请公布日期 |
1996.04.23 |
申请号 |
US19940270182 |
申请日期 |
1994.07.01 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MATSUURA, HIDEKAZU;IWASAKI, YOSHIHIDE;IKEDA, KAORI;SUZUKI, TAKAYUKI;TANAKA, MASASHI;MIYADERA, YASUO |
分类号 |
C08G73/10;C08L79/08;C09J179/08;H05K3/38;(IPC1-7):C08F283/04;C08L63/00 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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