| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method capable of easily manufacturing a resin molded semiconductor package which is excellent in reliability and largely contributes to improvement of the yield of a mounted circuit device. SOLUTION: This method consists of a process of fixing a semiconductor element 6 on the die pad 7b surface of a lead frame, a wire-bonding process of electrodes of the semiconductor element 6 surface corresponding to inner leads 7a stretching around the element 6, and a process of sealing the fixing region of the element 6 which contains bonding wires 8 by using resin 9. The semiconductor element 6 is fixed on the die pad 7b surface by using an adhesive tape 10 which is arranged via the die pad 7b. A part of the tape faces the rear of the element 6 and is bonded to it. |
