发明名称 PROCESS FOR PLACING MODULES ON A SUPPORT
摘要 The process enables modules, e.g. cells, to be placed on a support, e.g. a chip. For this purpose, the modules are arranged on the placement region of the support in such a manner that the centreof gravity of the modules coincides with the central co-ordinates of the placement region (global placement, stage S1). The placement region is then partitioned into partial regions, modules are allocated to the partial regions and the area of the partial regions is determined in relation to the area of the modules allocated to them (partitioning, stage S2). Global placement takes place again in the next step, i.e. the modules are arranged in the partial regions in such a way that the centres of gravity of the modules allocated to the partial regions coincide with the central co-ordinates thereof. The global placement and partitioning steps continue in succession until there are only k modules at the most per partial region. The final position of the modules is then determined with the aid of an optimisation stage (S3) in which the position of the modules is determined so as to make the best possible use of the area, taking into account the position of the modules obtained during global placement.
申请公布号 WO9005344(A1) 申请公布日期 1990.05.17
申请号 WO1989DE00688 申请日期 1989.10.26
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 ANTREICH, KURT;JOHANNES, FRANK;KLEINHANS, JUERGEN;SIGL, GEORG
分类号 H01L21/822;G06F17/50;H01L21/82;H01L27/04 主分类号 H01L21/822
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