| 摘要 |
PURPOSE: A semiconductor device capable of increasing a junction strength between a pad and a wire while forming a structure that is strong against a stress is provided. CONSTITUTION: An interconnection(8) formed on a chip and a pad(3) arranged by interposing an interlayer film(7) therebetween and joined with a bonding wire(6) are connected to each other by a contact(9). The contact is disposed at peripheral part of the pad. The contact of number corresponding to a region joined with the bonding wire is disposed at center part of the pad. The pad is formed in a rectangle shape. The contact is formed in a ring shape and equal interval at peripheral part and center part of pad. Thereby, it is possible to increase the junction strength between the pad and the wire while forming a structure that is strong against a stress. |
