N+ POLYSILICON ON HIGH-K DIELECTRIC SEMICONDUCTOR DEVICES
摘要
<p>Semiconductor devices with high-k dielectric layers and methods of their fabrication are provided. An n-type well region (304) is formed within a semiconductor body (302). A threshold voltage adjustment implant is performed by implanting a p-type dopant into the n-type well region to form a counter doped region (307). A high-k dielectric layer (308) is formed over the device (300). A polysilicon layer (310) is formed on the high-k dielectric layer and doped n-type. The high-k dielectric layer and the polysilicon layer are patterned to form polysilicon gate structures. P-type source/drain regions (306) are formed within the n-type well region.</p>
申请公布号
WO2006104893(A2)
申请公布日期
2006.10.05
申请号
WO2006US10806
申请日期
2006.03.24
申请人
TEXAS INSTRUMENTS INCORPORATED;VENUGOPAL, RAMESH;WASSHUBER, CHRISTOPH;SCOTT, DAVID, BARRY
发明人
VENUGOPAL, RAMESH;WASSHUBER, CHRISTOPH;SCOTT, DAVID, BARRY