Transmission module, shielding method, transmission cable, and connector

摘要

A transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a signal processing component mounted on the connector side substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal; and a transmission cable component for transmitting the high frequency signal including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line to which the high frequency signal is transmitted are formed, the cable side ground layer being disposed at least at lower and upper sides of the signal line as a part including the cable side ground layer of the cable side substrate is folded.

主权项

1. A transmission module, comprising:
a connector component including
a connector side substrate having a terminal component including a ground terminal and a data terminal, anda signal processing component mounted on the connector side substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal; and a transmission cable component for transmitting the high frequency signal including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line to which the high frequency signal is transmitted are formed, wherein the cable side ground layer being disposed at least at lower and upper sides of the signal line as a part including the cable side ground layer of the cable side substrate is folded, wherein the connector side substrate and the cable side substrate are configured as an integrated substrate made of a same material, wherein a connector side ground layer electrically connected to the ground terminal is formed on the connector side substrate, and wherein the connector side ground layer is disposed at least at lower and upper sides of an area where electromagnetic noises are generated due to the high frequency signal as a part including the connector side ground layer of the connector side substrate is folded.