| 发明名称 |
RF PACKAGE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
Disclosed is a method of improving performance and increasing a freedom degree of design of an interconnect structure in a radio frequency (RF) package. The RF package may include a package base, a semiconductor die mounted on the package base, a package substrate formed on the package base, the package substrate comprising at least one defected substrate structure (DSS), and a conducting pattern formed on one side of the package substrate and electrically connected with the semiconductor die, wherein the at least one DSS overlaps at least a portion of the conducting pattern in perspective of a top view of the RF package. |
| 申请公布号 |
US2016240494(A1) |
申请公布日期 |
2016.08.18 |
| 申请号 |
US201615045816 |
申请日期 |
2016.02.17 |
| 申请人 |
Electronics and Telecommunications Research Institute |
发明人 |
KIM Myunghoi |
| 分类号 |
H01L23/66;H01L21/50;H01L23/498;H01L23/00 |
主分类号 |
H01L23/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A radio frequency (RF) package, comprising:
a package base; a semiconductor die mounted on the package base; a package substrate formed on the package base, the package substrate comprising at least one defected substrate structure (DSS); and a conducting pattern formed on one side of the package substrate and electrically connected with the semiconductor die. |
| 地址 |
Daejeon KR |
