| 摘要 |
A printed circuit assembly and method of making the same utilize in one embodiment an adhesive layer including a plurality of non-conductive "gauge particles" disposed within a non-conductive adhesive. When the adhesive layer is disposed between opposing printed circuit layers (be they insulating substrates, conductive layers, or other layers), individual gauge particles are interposed or sandwiched at various points between the layers such that the diameters of the particles control the layer separation throughout overlapping areas of thereof, thereby permitting careful control over layer separation. A printed circuit assembly and method of making the same utilize in another embodiment an interlayer interconnecting technology incorporating conductive posts that are deposited on one of a pair of contact pads formed on opposing printed circuit boards and thereafter bonded to the other in the pair of contact pads during lamination. Fusible material may be utilized in the conductive posts to facilitate mechanical bonding to a contact pad, and the posts project through a dielectric layer disposed between the printed circuit boards, thereby forming the electrical connections between the boards at discrete locations. |
