| 摘要 |
PROBLEM TO BE SOLVED: To suppress transmission loss of a transmission line by forming the grooves on a semiconductor substrate which is adjacent to both sides of a signal line and securing a rectangular section having its adjacent side vertical to the substrate that is longer than its side, touching the substrate for a metallic signal line formed on the substrate and also a metallic ground line formed in parallel to the signal line respectively. SOLUTION: Grooves 104 are formed on a semiconductor substrate 101 at both sides of a signal line 102, and a space is provided between both grooves 104. The line 102 and a ground line 103 are formed, so that the side faces of both lines adjacent to each other are wider than each bottom surface set in parallel to the main surface of the substrate 101. In other words, a rectangle, having its adjacent sides (height) longer than its bottom line, is formed with regard to its section set vertical to the direction where the line 102 extends. In such a constitution, more spaces are secured around the line 102, and the areas of the substrate 101 are decreased relatively around the line 102. |
