| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical communication module capable of avoiding a fault due to infiltration of adhesive resin into an optical path groove, and to enhance positioning accuracy of a photodetector to an optical path. SOLUTION: The optical communication module includes: a semiconductor substrate; and a photodetector mounted on the semiconductor substrate with the adhesive resin, for converting received light (reception light) into an electric signal. The optical path groove through which the received light to be guided to the photodetector passes is formed on the semiconductor substrate. A fitting part to be disposed in the optical path groove is formed in the bottom part of the photodetector. COPYRIGHT: (C)2010,JPO&INPIT
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