SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To realize a semiconductor package-laminated structure while the increase of the thickness of the structure is suppressed.

SOLUTION: In the laminated structure, a carrier substrate 21 having a larger size than a carrier substrate 11 has is mounted on the substrate 11 so that the substrate 21 may be protruded from the substrate 11 by joining bump electrodes 26 to lands 12c provided on the substrate 11.

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