| 摘要 |
PURPOSE:To produce a semiconductor lead frame in which the projective precipitation of Ag plating can be improved by the improvement of the copper alloy stock itself and the projective precipitation of the Ag plating is hard to cause. CONSTITUTION:In a copper alloy for a semiconductor lead frame to be applied with Ag plating, the contents of Mg and Ca as impurity elements are regulated to, by weight, <=10ppm Mg and <=10ppm Ca. This copper alloy contains 1.0 to 3.0% Fe, 0.015 to 0.15% P, 0.05 to 0.20% Zn, and the balance copper with inevitable impurities, and furthermore, the one contg. 0.0010 to 0.020% Al in the copper alloy can be used. |
