发明名称 |
Heat sink and combinations |
摘要 |
The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.
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申请公布号 |
US6807058(B2) |
申请公布日期 |
2004.10.19 |
申请号 |
US20020300058 |
申请日期 |
2002.11.20 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MATTESON JASON AARON;CRIPPEN MARTIN JOSEPH |
分类号 |
H01L23/367;H01L23/467;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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