| 摘要 |
<p>An epoxy resin composition suitable for encapsulating a semiconductor contains an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a phosphate ester compound (D), wherein the content of the inorganic filler (C) is at least 80 wt.% of the composition. The epoxy resin composition for encapsulating a semiconductor which has excellent flame retardancy, moldability, reliability and soldering heat resistance can be obtained without particularly using any halogen flame-retardants and antimony flame-retardants.</p> |
