Integrated circuit (IC) package with thick die pad functioning as a heat sink

摘要

An integrated circuit (IC) package includes a die pad and an IC die secured on the die pad. The IC die had outer edges aligned with outer edges of the die pad. An encapsulating material body surrounds the die pad and IC die. Leads extend outwardly from the encapsulating material body and are coupled to the IC die. Each lead has an upper surface coplanar with an upper surface of the IC die. The die pad has a lower surface exposed through the encapsulating material body, and has a thickness greater than a thickness of each of the plurality of leads.

主权项

1. An integrated circuit (IC) package comprising:
a die pad having a rectangular shape with parallel sidewalls; an IC die secured on said die pad, with said IC die having a rectangular shape with parallel sidewalls aligned with the parallel sidewalls of said die pad; an encapsulating material body surrounding said die pad and IC die; and a plurality of leads extending outwardly from said encapsulating material body and coupled to said IC die, each lead having an upper surface being coplanar with an upper surface of said IC die; said die pad having a lower surface exposed through said encapsulating material body, and having a thickness greater than a thickness of each of said plurality of leads.