A device for cleaning semiconductor wafers is provided. The device includes a carrier for holding wafers during the cleaning process. The carrier includes a frame with an open top and a plurality of carrier rods extending between opposite ends of the frame. The carrier rods have grooves that receive marginal edge portions of the wafers to retain them against movement in the carrier during cleaning and transportation. The grooves are structured to reduce the amount of contaminants remaining on the wafers after cleaning. The frame may be made substantially entirely of a polymeric material.
