Flip chip type saw band reject filter design

摘要

A method and system for providing a surface acoustic wave band reject filter are disclosed. According to one aspect, a surface acoustic wave band reject filter includes a substrate having electrode bars and bonding pads formed on the substrate. The filter further includes at least one die having a side facing the substrate. A plurality of surface acoustic wave resonators are formed on the at least one die formed on the substrate. Solder balls formed on a side of the at least one die facing the substrate are positioned to engage bonding pads on the substrate. The plurality of surface acoustic wave resonators collectively exhibit a band reject filter response.

主权项

1. A surface acoustic wave band reject filter, comprising:
a substrate, the substrate including electrode bars and bonding pads formed on the substrate; and at least one die having a side facing the substrate; at least three surface acoustic wave resonators, all of the surface acoustic wave resonators being formed on the at least one die, the at least one die mounted on the substrate; solder balls in contact with the side of the at least one die facing the substrate, the solder balls positioned to be in electrical contact with the electrode bars and bonding pads on the substrate, the at least three surface acoustic wave resonators being connected by the electrode bars and bonding pads via the solder balls and collectively exhibiting a band reject filter response; all of the surface acoustic wave resonators formed on a single die of the at least one die being adjacent and geometrically aligned so that main axes oriented along a length of each of the surface acoustic wave resonators are one of parallel and coincident.