发明名称 |
Etching method and etching apparatus. |
摘要 |
<p>A mounting surface of an electrode (11) for mounting an object to be processed thereon is projected to be a curved surface identical to a curved surface obtained by deforming the object to be processed by a uniform load, and etching of the object (12) to be processed is performed. Etching of the object (12) to be processed can be easily and stably performed, thereby improving yield and productivity.</p> |
申请公布号 |
EP0323620(A2) |
申请公布日期 |
1989.07.12 |
申请号 |
EP19880121606 |
申请日期 |
1988.12.23 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
HORIUCHI, TAKAO;ARAI, IZUMI;TAHARA, YOSHIFUMI |
分类号 |
H01J37/32;H01L21/00 |
主分类号 |
H01J37/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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