发明名称 |
Electronic component cooling apparatus |
摘要 |
An electronic component cooling apparatus capable of permitting a sufficient amount of air to be fed to an electronic component to be cooled. An impeller which includes a plurality of blades for sucking air from one side in an axial direction of a revolving shaft of a motor is fixed on a rotor of the motor. A casing having a cylindrical cavity defined therein in which the motor and impeller are received is constructed of a peripheral wall arranged so as to surround the impeller and a closing wall for closing an end of the cavity on the other side in the axial direction. The peripheral wall is formed at a portion thereof in proximity to an end thereof on the one side with a lateral discharge port through which air suckedly introduced into the cavity is discharged so that a surrounding portion for surrounding a whole circumference of the impeller is left at a portion of the peripheral wall in proximity to an end on the other side. The casing is provided with a spacer means for providing an interval between the casing and an opposite member.
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申请公布号 |
US5910694(A) |
申请公布日期 |
1999.06.08 |
申请号 |
US19980154920 |
申请日期 |
1998.09.17 |
申请人 |
SANYO DENKI CO., LTD. |
发明人 |
YOKOZAWA, SHINJIRO;KODAMA, NOBUMASA;OGAWARA, TOSHIKI;KODAIRA, YUICHI;WATANABE, MICHINORI |
分类号 |
F04D25/06;F04D29/58;H05K7/20;(IPC1-7):H02K5/00 |
主分类号 |
F04D25/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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